List of Published Presentation Papers（Mar.2002─May 2002） Date of Name of Publication Presentation Name of Paper[removed]Feasibility Study on a Highly Mobile Microwave- EEE TRANSACTIONS ON INTELBand Broad-band Te

Source URL: www.nict.go.jp

• Gallium nitride
• IEEE Microwave and Wireless Components Letters
• Institute of Electrical and Electronics Engineers
• Chemistry
• Optics
• Photonics

Precision Time Protocol IEEE[removed]Product Range Sub-Microsecond Synchronization for Ethernet Network Environments

Source URL: www.meinberg-usa.com

• Oscillators
• Synchronization
• Network protocols
• Precision Time Protocol
• Electrical components
• Crystal oven
• Pulse per second
• Time server
• Crystal oscillator
• Technology
• Measurement
• Electronics

CATEGORY 5-TELECOMMUNICATIONS AND "INFORMATION SECURITY" Part 1-Telecommunications Notes: 1. The status of components, test and "production" equipment and "software" therefor which are specially designed for telecommunic

Source URL: www.stc.tid.gov.hk.

• Radio
• Electromagnetic spectrum
• Microwave
• Wireless
• Ultra-wideband
• Wavelength-division multiplexing
• IEEE 802.11
• Amplifier
• Optical fiber
• Technology
• Telecommunications engineering
• Electromagnetic radiation

Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org

Source URL: cpmt.ieee.org

• Professional associations
• Standards organizations
• Technology
• Institute of Electrical and Electronics Engineers
• Universidade Federal do ABC
• Three-dimensional integrated circuit
• Bahgat G. Sammakia
• IEEE Components
• Packaging & Manufacturing Technology Society
• International nongovernmental organizations
• Engineering
• Electronic engineering

Analytical Modeling of Spreading Resistance in Flux Tubes, Half Spaces, and Compound Disks - Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on [see also Compon

Source URL: www.mhtlab.uwaterloo.ca

• Heat conduction
• Physical quantities
• Passive fire protection
• Thermodynamics
• Thermal conductivity
• R-value
• Thermal conduction
• Heat sink
• Flux
• Heat transfer
• Mechanical engineering
• Chemical engineering

Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection - Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Source URL: www.mhtlab.uwaterloo.ca

BASIC SCIENCES JOURNALS Indian Journal of Mathematics Bulletin of the

Source URL: grietinfo.in

• Raj Senani
• IEEE Microwave and Wireless Components Letters
• International nongovernmental organizations
• Institute of Electrical and Electronics Engineers
• Engineering

IEEE­SA C/VSSC/VM_WG Telecon & Web Meeting Attendance    The meeting uses the IEEE­SA provided service from join.me and includes  Web/presentation (optional) and audio components. VoIP is free

Source URL: grouper.ieee.org

• Videotelephony
• Android software
• Broadband
• Voice over IP
• Internet
• Tru
• Emirates Integrated Telecommunications Company
• Ovi
• Software
• Technology
• Electronics

Causality and Waveguide Circuit Theory Dylan F. Williams, Senior Member, IEEE, and Bradley K. Alpert, Member, IEEE National Institute of Standards and Technology, 325 Broadway, Boulder, CO[removed]Ph: [+[removed]Fa

Source URL: www.nist.gov

• Physical quantities
• Electrical components
• Electronic design
• Cables
• Telecommunications engineering
• Electrical impedance
• Transmission line
• Wave impedance
• Waveguide
• Electronic engineering
• Electromagnetism
• Physics

1858 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 58, NO. 7, JULY 2010 Design and Analysis of 1-D Uniform and Chirped Electromagnetic Bandgap Structures in

Source URL: www.photonics.ece.mcgill.ca

• Optics
• Telecommunications engineering
• Electrical components
• Waveguide
• Post wall
• Microstrip
• Transmission line
• Dispersion
• Cutoff frequency
• Technology
• Electronic engineering
• Electromagnetism